New technical paper titled “All-in-one, bio-inspired, and low-power crypto engines for near-sensor security based on two-dimensional memtransistors” from researchers at Penn State University.
Abstract: “In the emerging era of the internet of things (IoT), ubiquitous sensors continuously collect, consume, store, and communicate a huge volume of information which is becoming increasingly vulnerable to theft and misuse. Modern software cryptosystems require extensive computational infrastructure for implementing ciphering algorithms, making them difficult to be adopted by IoT edge sensors that operate with limited hardware resources and at low energy budgets. Here we propose and experimentally demonstrate an “all-in-one” 8 × 8 array of robust, low-power, and bio-inspired crypto engines monolithically integrated with IoT edge sensors based on two-dimensional (2D) memtransistors. Each engine comprises five 2D memtransistors to accomplish sensing and encoding functionalities. The ciphered information is shown to be secure from an eavesdropper with finite resources and access to deep neural networks. Our hardware platform consists of a total of 320 fully integrated monolayer MoS2-based memtransistors and consumes energy in the range of hundreds of picojoules and offers near-sensor security.”
Find the open access technical paper here. Published June 2022.
Dodda, A., Trainor, N., Redwing, J.M. et al. All-in-one, bio-inspired, and low-power crypto engines for near-sensor security based on two-dimensional memtransistors. Nat Commun 13, 3587 (2022). https://doi.org/10.1038/s41467-022-31148-z.
Further Reading: Technical papers on Security Chip Substitutions Raising Security Concerns Lots of unknowns will persist for decades across multiple market segments. Building Security Into ICs From The Ground Up No-click and blockchain attacks point to increasing hacker sophistication, requiring much earlier focus on potential security risks and solutions. Hiding Security Keys Using ReRAM PUFs How two different technologies are being combined to create a unique and inexpensive security solution. Verifying Side-Channel Security Pre-Silicon Complexity and new applications are pushing security much further to the left in the design flow.
Name* (Note: This name will be displayed publicly)
Email* (This will not be displayed publicly)
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.